Product Summary

Datasheets APEX 20K Device Family Data Sheet
672-FBGA Pkg Info
Virtual JTAG Megafuntion User Guide
Product Photos 672-FBGA Pkg
DS-672FBGA205-2_0
Product Training Modules Three Reasons to Use FPGA's in Industrial Designs
Standard Package ?  40
Category Integrated Circuits (ICs)
Family Embedded - FPGAs (Field Programmable Gate Array)
Series APEX-20KE?
Number of LABs/CLBs 1664
Number of Logic Elements/Cells 16640
Total RAM Bits 212992
Number of I/O 488
Number of Gates 1052000
Voltage - Supply 1.71 V ~ 1.89 V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C
Package / Case 672-BBGA, FCBGA
Supplier Device Package 672-FBGA (27x27)
Other Names 544-2095

Diagrams

This datasheet provides package and thermal resistance information for mature
Altera? devices. Package information includes the ordering code reference, package
acronym, leadframe material, lead finish (plating), JEDEC outline reference, lead
coplanarity, weight, moisture sensitivity level, and other special information. The
thermal resistance information includes device pin count, package name, and
resistance values.
This datasheet includes the following sections:
■ “Device and Package Cross Reference” on page 1
■ “Thermal Resistance” on page 23
■ “Package Outlines” on page 44
f For more package and thermal resistance information about Altera devices that are
not listed in this datasheet, refer to thePackage and Thermal Resistancepage of the
Altera website.
f For information about trays, tubes, and dry packs, refer to AN 71: Guidelines for
Handling J-Lead, QFP, and BGA Devices.
f RoHS-compliant devices are compatible with leaded-reflow temperatures. For more
information, refer to Altera’s RoHS-Compliant Devices literature page.
Device and Package Cross Reference
Table 2 throughTable 22 lists the device, package type, and number of pins for each
Altera device listed in this datasheet. Altera devices listed in this datasheet are
available in the following packages:
■ Ball-Grid Array (BGA)
■ Ceramic Pin-Grid Array (PGA)
■ FineLine BGA (FBGA)
■ Hybrid FineLine BGA (HBGA)
■ Plastic Dual In-Line Package (PDIP)
■ Plastic Enhanced Quad Flat Pack (EQFP)
■ Plastic J-Lead Chip Carrier (PLCC)
■ Plastic Quad Flat Pack (PQFP)
■ Power Quad Flat Pack (RQFP)
■ Thin Quad Flat Pack (TQFP)
■ Ultra FineLine BGA (UBGA)

Image Part No Mfg Description Data Sheet Download Pricing
(USD)		 Quantity
EP20K400EFC672-2X
EP20K400EFC672-2X

IC APEX 20KE FPGA 400K 672-FBGA
Data Sheet
0-40: $590.40
Image Part No Mfg Description Data Sheet Download Pricing
(USD)		 Quantity
EP2001-9R
EP2001-9R

EURO-CASSETTE 120W 2X 5.1V
Data Sheet
0-5: $454.74
EP201
EP201
Other

Data Sheet
Negotiable 
EP2012
EP2012
Hammond Manufacturing
Electrical Enclosure Accessories E PANEL FITS 20X1224
Data Sheet
Negotiable 
EP2016
EP2016
Hammond Manufacturing
Electrical Enclosure Accessories E-PANEL FITS 20 X 16
Data Sheet
0-1: $25.07
1-2: $23.60
2-5: $22.12
5-10: $20.65
EP2020
EP2020
Hammond Manufacturing
Electrical Enclosure Accessories E-PANEL FITS 20 X 20
Data Sheet
0-1: $33.28
1-2: $30.62
2-5: $28.67
5-10: $26.90
EP2024
EP2024
Hammond Manufacturing
Electrical Enclosure Accessories E-PANEL FITS 20 X 24
Data Sheet
0-1: $42.59
1-2: $39.19
2-5: $36.70
5-10: $34.43